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Copper-tungsten alloy

The market for copper-tungsten alloys is poised for explosive growth due to rising demand from diverse industries and advancements in technology. Copper-tungsten alloy is a versatile material that is increasingly gaining importance across various sectors, including aerospace and electronics, thanks to its exceptional conductivity and remarkable thermal resistance.

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Product Description

Copper-tungsten alloy

Copper-tungsten alloy plate/sheet, manufactured through isostatic pressing, high-temperature sintering, and a copper infiltration process. These can be produced as heat-conducting plates for frames, chip carriers, and high-power electronic devices. They exhibit excellent thermal conductivity and low thermal expansion—specifically, their expansion rate matches that of silicon carbide, alumina oxide, and beryllium oxide. Thanks to these outstanding properties, copper-tungsten plates are the ideal material for integrated circuits and are widely used across various industries.

Round bar made of copper-tungsten alloy

Round bar of copper-tungsten alloy: the manufacturing process consists of static pressure molding, high-temperature sintering, and soluble copper infiltration.

Specifications for the copper-tungsten bar: diameter ≥ 0.9 mm, length ≤ 300 mm.

Copper and tungsten block
Copper-tungsten block: they are manufactured using fine powder of tungsten and copper, and pulvimetallurgy technology is employed.

Advantages of tungsten copper: resistance to high temperatures, excellent arc resistance, superior strength, and good thermal and electrical conductivity properties.

The composition of the copper-tungsten bar/block: 55%-90% W, with copper as the other component.

All copper and tungsten bars/blocks can be manufactured according to customer requirements.

Grade and mechanical properties

Rating	Density	Conductivity	Coefficient of expansion
WCu7	17.5	150	5.5
WCu10	17.0	160	6.2
WCu15	16.2	170	6.9
Wcu20	15.4	180	7.4
Wcu25	14.7	200	8.0
Wcu30	14.1	220	8.8